OECHSLER's 3D-printed backpack wins Red Dot Design Award

Red Dot Design Award "Best of the Best" for 3D-printed backpack elements
  • OECHSLER wins Red Dot Design Award in the Design Concept Categorie
  • Honored for "exciting new design concepts and sustainable innovation capability"
  • OECHSLER backpack enables more comfortable carrying experience and passive cooling

OECHSLER has been awarded with the Red Dot Design Award "Best of the Best" in the Design Concept category for its trekking backpack with 3D-printed back padding. The prestigious design award is presented annually in the categories of Product Design, Brand and Communication Design and Design Concept. As part of the award ceremony at the Red Dot Design Museum in Singapore, OECHSELR's Trekking Backpack will now be on display for four weeks.

"The Red Dot Design Award tracks and measures a company's success in producing exciting new design concepts, and reflects an organization's true sustainable innovation capability," said Red Dot in describing its approach to the Design Concept category.

The OECHSLR concept backpack allows for a totally design approach through open lattice structures. On the one hand, the Lattice pads on the upper back and the hip belt provide increased ventilation and reduce the temperature in the back area by three to five degrees Celsius. On the other hand, the Lattice struts in a component can be designed with different degrees of hardness and adapted to the body geometry with the help of Boddy Mapping. In this way, OECHSLER was able to achieve a completely new wearing sensation. The TPU material used by OECHSLER is fully recyclable.

Congratulations to the Additive Manufacturing project team around Andreas Knöchel, Leonhard Klein and Christian Maedrich.

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