Innovation 3D MID
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They control the headlight beam angle of cars and turbochargers of diesel engines; they can be found in components for telecommunica-tions, computer and medical engineering as well as in sensor technol-ogy and electronic modules for household appliances and hi-fi systems: 3D MIDs (3D Molded Interconnected Devices) are, for some little time now, about to revolutionize electronics and mechatronics – with enormous annual growth rates! |
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3D MID assemblies are capable of inte-grating electronic and mechanical functions into a single circuit carrier – more flexible, more cost-efficient and also more environmentally friendly than con-ventional circuit boards. And this pays off, especially in the case of electronics that has great potential for integrating me-chanical functions and requires a high degree of assembly:
- 3D MIDs offer more flexibility in design
and functionality on a minimum of space because of their three
dimensional layout and through optimum utilization of the space
available.
- 3D MIDs are cost-efficient in production, since the material
consumption and the number of parts is reduced – as a result,
assembly costs decrease.
- 3D MIDs are ecofriendly – they require less material and are
remarkable for good recyclability of base materials.
OECHSLER – 3D MIDs at a glance
- Development and series production of innovative 3D MID assemblies
- Development and production services from a single source
- Consultancy in molded parts design, choice of material and
processing techniques
- Laser direct structuring (LDS), hot stamping, multicomponent
technology, insert molding
OECHSLER is a member of the research association for 3D MIDs and offers you the development and the manufacture of MID's from a single source.
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For further information please read our Information Sheet 3D MID. |
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